Robotics Education & Competition Foundation
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Texas Instruments Challenge-by the Golden Gears


Entry ID #: 3623
Created: Wed, Jan 11, 2017 10:14 AM

We chose a Samsung Galaxy S III for the Texas Instruments Electronics Challenge because we have had this phone for a while and the glass screen was cracked. We found 12 screws, a camera backing, the camera, the mother board with a couple of parts, internal back cover, the back cover, a back up battery, power button, volume button, the inside front of the phone and the actual front phone cover with the glass.  There are at least 6 chips located on the front of the motherboard as well as 5 chips located on the back. Chipworks is the name of the company who supply these chips. The first compenent is the outer back cover of the phone; it protects the inside of the phone. Second, is the internal back cover that protects the guts of the phone. The third component is the battery which of course powers the phone. After that we had to take out 12 screws to get inside the back of the phone. Then we took off the backing to the camera which protects it and helps hold it in place. We found a battery which is used for backup. We were also able to take off the power button which of course powers the phone on and off and and the volume button which controls the phones volume. That last and probably one of the most important compenets was the motherboard. These are the chips we found on the front of the motherboard:  Murata M2322007 WiFi Module(red), Samsung Exynos 4412 quad-core A9 processor with 1 GB LP DDR2 Green Memory (K3PE7E700M-XGC2)(orange), Samsung KMVTU000LMeMMC(16GB)+MDDR(64MB) NAND Flash(yellow), Intel Wireless PMB9811X Gold Baseband processor(green), MAX77693 and MAX77686(blue), Broadcom BCM47511 Integrated Monolithic GNSS Receiver(purple), 33ODC 2214 4TP AC(black) The chips on the back of the motherboard are below: Wolfson Microelectronics WM1811 stereo codec(red), Skyworks SKY77604 Multi-Band Power amplifier(orange), Silicon Image 9244 low-power MHL Transmitter(blue), NXP PN544 NFC Chip.(green), Infineon PMB5712 RF transceiver(yellow). In conclusion, We found no Texas INstrument components in the Samsung phone. We realized how many compnenets and small things actually go into building a phone. Also that the motherboard is the brain of the whole fun.  There is so much advance technology that goes into building phones and its intersting to take apart and see all of it.


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